Paper
12 September 2003 MIRAGE: developments in IRSP system development, RIIC design, emitter fabrication, and performance
Paul Tristan Bryant, Jim Oleson, Brian Lindberg, Bruce Anderson, Kevin Sparkman, Stephen W. McHugh, John Lannon, David Vellenga, Scott Goodwin, Steve L. Solomon
Author Affiliations +
Abstract
SBIR's family of MIRAGE infrared scene projection systems is undergoing significant growth and expansion. SBIR has completed the transition of Honeywell's resistive emitter technology to MCNC Research and Development Institute (MCNC-RDI), and is preparing for first-lot production of IR emitters in support of ongoing programs. Development of MIRAGE resistive emitter-based products is underway in order to increase maximum scene temperature, decrease radiance rise time, and improve overall operation. The 1024 x 1024 Large Format Resistive Array (LFRA) Read-In Integrated Circuit (RIIC) has been fabricated and tested, with emitter fabrication to start in mid-2003. A next-generation MIRAGE II(512 x 512) RIIC is also ready for fabrication, in support of high-performance MIRAGE II 512 x 512 systems providing greater than 750 K MWIR apparent temperature, and less than 5 ms 10-90% MWIR radiance rise time. In support of these new technologies and products, SBIR has developed test equipment and facilities for use in next-generation MIRAGE device wafer probing, test, evaluation, diagnostic, and assembly processes.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Paul Tristan Bryant, Jim Oleson, Brian Lindberg, Bruce Anderson, Kevin Sparkman, Stephen W. McHugh, John Lannon, David Vellenga, Scott Goodwin, and Steve L. Solomon "MIRAGE: developments in IRSP system development, RIIC design, emitter fabrication, and performance", Proc. SPIE 5092, Technologies for Synthetic Environments: Hardware-in-the-Loop Testing VIII, (12 September 2003); https://doi.org/10.1117/12.498101
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Cited by 7 scholarly publications.
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KEYWORDS
Nonuniformity corrections

Semiconducting wafers

Mid-IR

Chromium

Digital signal processing

Prototyping

Cameras

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