12 September 2003 Three approaches in infrared imaging of electronic devices
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We present further progress in high-resolution time-resolved thermal imaging of electronic and optoelectronic devices. We show that concurrent multi-spectral mapping of light, emissivity, and heat patterns a single device produces may hold the key of the device performance improvement by visualizing current carrier distribution and heat flows. To demonstrate advantage of this approach, thermal heaters, light emitting devices, and Peltier coolers are tested with emphasis laid on uniformity of carrier distribution and thermal control.
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Volodymyr K. Malyutenko, Volodymyr K. Malyutenko, "Three approaches in infrared imaging of electronic devices", Proc. SPIE 5092, Technologies for Synthetic Environments: Hardware-in-the-Loop Testing VIII, (12 September 2003); doi: 10.1117/12.516466; https://doi.org/10.1117/12.516466

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