A back-to-back micromirror device for optical add/drop multiplexer applications

Yu-Chen Lin; Jin-Chern Chiou

doi:10.1117/12.498870

24 April 2003 A back-to-back micromirror device for optical add/drop multiplexer applications

Yu-Chen Lin; Jin-Chern Chiou

Author Affiliations +

Proceedings Volume 5116, Smart Sensors, Actuators, and MEMS; (2003) https://doi.org/10.1117/12.498870
Event: Microtechnologies for the New Millennium 2003, 2003, Maspalomas, Gran Canaria, Canary Islands, Spain

Abstract

In this paper, a back-to-back micromirror device fabricated through surface-micromachining and flip chip packaging technologies is developed for optical add/drop multiplexer applications. Pre-stressed beams were designed to elevate micromirror devices after the release and thermal heat-treatment processes. Torsion flexure structure design provides a reliable rotation degree of freedom for micromirror devices. A mechanical stopper was bonded using flip chip packaging on the top of micromirror devices to constrain the popped-up micromirror to obtain precise deflecting angle. Preliminary experiments had demonstrated the feasibility of the micromirror devices.

Citation Download Citation

Yu-Chen Lin, Jin-Chern Chiou, "A back-to-back micromirror device for optical add/drop multiplexer applications", Proc. SPIE 5116, Smart Sensors, Actuators, and MEMS, (24 April 2003); doi: 10.1117/12.498870; https://doi.org/10.1117/12.498870

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