24 April 2003 A back-to-back micromirror device for optical add/drop multiplexer applications
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In this paper, a back-to-back micromirror device fabricated through surface-micromachining and flip chip packaging technologies is developed for optical add/drop multiplexer applications. Pre-stressed beams were designed to elevate micromirror devices after the release and thermal heat-treatment processes. Torsion flexure structure design provides a reliable rotation degree of freedom for micromirror devices. A mechanical stopper was bonded using flip chip packaging on the top of micromirror devices to constrain the popped-up micromirror to obtain precise deflecting angle. Preliminary experiments had demonstrated the feasibility of the micromirror devices.
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Yu-Chen Lin, Yu-Chen Lin, Jin-Chern Chiou, Jin-Chern Chiou, } "A back-to-back micromirror device for optical add/drop multiplexer applications", Proc. SPIE 5116, Smart Sensors, Actuators, and MEMS, (24 April 2003); doi: 10.1117/12.498870; https://doi.org/10.1117/12.498870

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