24 April 2003 Adhesive wafer bonding for MEMS applications
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Abstract
Low temperature wafer bonding is a powerful technique for MEMS/MOEMS devices fabrication and packaging. Among the low temperature processes adhesive bonding focuses a high technological interest. Adhesive wafer bonding is a bonding approach using an intermediate layer for bonding (e.g. glass, polymers, resists, polyimides). The main advantages of this method are: surface planarization, encapsulation of structures on the wafer surface, particle compensation and decrease of annealing temperature after bonding. This paper presents results on adhesive bonding using spin-on glass and Benzocyclobutene (BCB) from Dow Chemicals. The advantages of using adhesive bonding for MEMS applications will be illustrated be presenting a technology of fabricating GaAs-on-Si substrates (up to 150 mm diameter) and results on BCB bonding of Si wafers (200 mm diameter).
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Viorel Dragoi, Viorel Dragoi, Thomas Glinsner, Thomas Glinsner, Gerald Mittendorfer, Gerald Mittendorfer, Bernhard Wieder, Bernhard Wieder, Paul Lindner, Paul Lindner, } "Adhesive wafer bonding for MEMS applications", Proc. SPIE 5116, Smart Sensors, Actuators, and MEMS, (24 April 2003); doi: 10.1117/12.499077; https://doi.org/10.1117/12.499077
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