24 April 2003 Adhesive wafer bonding for MEMS applications
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Low temperature wafer bonding is a powerful technique for MEMS/MOEMS devices fabrication and packaging. Among the low temperature processes adhesive bonding focuses a high technological interest. Adhesive wafer bonding is a bonding approach using an intermediate layer for bonding (e.g. glass, polymers, resists, polyimides). The main advantages of this method are: surface planarization, encapsulation of structures on the wafer surface, particle compensation and decrease of annealing temperature after bonding. This paper presents results on adhesive bonding using spin-on glass and Benzocyclobutene (BCB) from Dow Chemicals. The advantages of using adhesive bonding for MEMS applications will be illustrated be presenting a technology of fabricating GaAs-on-Si substrates (up to 150 mm diameter) and results on BCB bonding of Si wafers (200 mm diameter).
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Viorel Dragoi, Viorel Dragoi, Thomas Glinsner, Thomas Glinsner, Gerald Mittendorfer, Gerald Mittendorfer, Bernhard Wieder, Bernhard Wieder, Paul Lindner, Paul Lindner, "Adhesive wafer bonding for MEMS applications", Proc. SPIE 5116, Smart Sensors, Actuators, and MEMS, (24 April 2003); doi: 10.1117/12.499077; https://doi.org/10.1117/12.499077


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