24 April 2003 Simulation of bulk micromachined vibration sensor with low noise
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In this paper a novel capacitive micro-vibration sensor with multi-folding beams, fabricated by bulk micromachining, is presented. The microstructures of the vibration sensor are simulated by the finite element method (FEM). The relations between the structural parameters and the sensitivity and frequency response of the sensor were considered in the simulation. The static and modal analyzing results of the sensors show that the higher sensitivity and mechanical strength with multi-folding beam structure were achieved. The microstructure with beam thickness under 400um can be fabricated with DRIE technology. When the area of silicon proof mass is 2.5×105 μm2, and the thickness of the proof mass vary from 40 μm to 80 μm, the mechanical noise is about 9×10-6g/√Hz. The sensor with resonant frequency up to 5kHz can be used to measure the vibration signal in a wider frequency range.
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Xiaowei Liu, Xiaowei Liu, Mingxue Huo, Mingxue Huo, Weiping Chen, Weiping Chen, Qiang Chen, Qiang Chen, } "Simulation of bulk micromachined vibration sensor with low noise", Proc. SPIE 5116, Smart Sensors, Actuators, and MEMS, (24 April 2003); doi: 10.1117/12.498848; https://doi.org/10.1117/12.498848

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