2 September 2003 Laser welding of polymers using high-power diode lasers
Author Affiliations +
Proceedings Volume 5121, Laser Processing of Advanced Materials and Laser Microtechnologies; (2003); doi: 10.1117/12.515630
Event: Laser Processing of Advanced Materials and Laser Microtechnologies, 2002, Moscow, Russian Federation
Abstract
Laser welding of polymers using high power diode lasers offers specific process advantages over conventional technologies, such as short process times while providing optically and qualitatively valuable weld seams, contactless yielding of the joining energy, absence of process induced vibrations, imposing minimal thermal stress and avoiding particle generation. Furthermore this method exhibits high integration capabilities and automatization potential. Moreover, because of the current favorable cost development within the high power diode laser market laser welding of polymers has become more and more an industrially accepted joining method. This novel technology permits both, reliable high quality joining of mechanically and electronically highly sensitive micro components and hermetic sealing of macro components. There are different welding strategies available, which are adaptable to the current application. Within the frame of this discourse scientific and also application oriented results concerning laser transmission welding of polymers using preferably diode lasers are presented. Besides the used laser systems the fundamental process strategies as well as decisive process parameters are illustrated. The importance of optical, thermal and mechanical properties is discussed. Applications at real technical components will be presented, demonstrating the industrial implementation capability and the advantages of a novel technology.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Friedrich G. Bachmann, Ulrich A. Russek, "Laser welding of polymers using high-power diode lasers", Proc. SPIE 5121, Laser Processing of Advanced Materials and Laser Microtechnologies, (2 September 2003); doi: 10.1117/12.515630; https://doi.org/10.1117/12.515630
PROCEEDINGS
14 PAGES


SHARE
Back to Top