22 September 2003 Analysis of adsorption of alcohol additives in the process of silicon etching in alkaline solutions
Author Affiliations +
Proceedings Volume 5124, Optoelectronic and Electronic Sensors V; (2003) https://doi.org/10.1117/12.517059
Event: Optoelectronic and Electronic Sensors V, 2002, Rzeszow, Poland
Abstract
The effect of alcohol additives on silicon anisotropic etching process in KOH solutions has been analysed. It has been stated that the additives modify the anisotropy of the etching process, which results in reduction of etch rates of some crystal planes with specific configuration of surfacial bonds. After considering the bonds configuration on these planes and alcohol molecules dimensions it has been stated that the effective blocking of these planes is directly related to their spatial structure and the structure of alcohol molecule. Obtained results should enable deliberate selection of the additives to etching solutions and the choice of solutions compositions, assuring possible small undercut of convex corners.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Irena Zubel, Malgorzata Kramkowska, "Analysis of adsorption of alcohol additives in the process of silicon etching in alkaline solutions", Proc. SPIE 5124, Optoelectronic and Electronic Sensors V, (22 September 2003); doi: 10.1117/12.517059; https://doi.org/10.1117/12.517059
PROCEEDINGS
8 PAGES


SHARE
Back to Top