24 October 2003 Lead-free technologies for electronic equipment assembly
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Proceedings Volume 5125, Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments; (2003) https://doi.org/10.1117/12.532363
Event: Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments 2002, 2002, Wilga, Poland
Abstract
The electronic industry is now going through a difficult period. The companies must cut costs, regroup and innovate. Environmentally friendly production from cradle-to-grave can be an essential element of future manufacturing trends. Recognizing leaf-free technology implementation it is necessary to consider the following elements: solder, printed circuit board and component finish or assembly technology. In the paper, the [hysical properties of chosen Pb-free solders were presented. There were analyzed the advantages and disadvantages of two PCB assembly methods: lead free soldering and gluing by condictive adhesive. The comparison of electrical and mechanical properties of joints made by Pb-free solders and two types of conductive adhesives were presented too. It was concluded that the exploitation parameters of joints made by Pb-free solders are proper for PCB assembly. Conductive adhesives may replace solders in these applications were the low value of joint resistance is not critical.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ryszard Kisiel, Ryszard Kisiel, } "Lead-free technologies for electronic equipment assembly", Proc. SPIE 5125, Photonics Applications in Astronomy, Communications, Industry, and High-Energy Physics Experiments, (24 October 2003); doi: 10.1117/12.532363; https://doi.org/10.1117/12.532363
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