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30 September 2003 Magnetothermoelectrical and adhesive properties of commutation contacts of thermoelements on the basis of extruded samples of Bi85Sb15 solid solution
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Abstract
A study of electrical and adhesive properties of transient contacts for extruded samples of Bi85Sb15 solid solutions have been conducted with alloys: 25Bi + 50Pb + 12.5Cd + 12.5Sn with Tm = 343 K (Wood"s alloy) and 57Bi + 45Sn with Tm =412 K in temperature range ~77-300 K and magnetic field intensity (H) up to ~74x104 A/m. It is shown that resistance of transient contacts (rk) of the extruded of Bi85Sb15 solid solution with the specified contact alloys at ~77K is determined by the resistance of the structure the solid solution Bi85Sb15-solid solution Bi85Sb15, heavily doped by Pb and Sn atoms, diffused from contact alloy into near-contact area of the Bi85Sb15 solid solution. It is established, that by doping extruded samples of Bi85Sb15 solid solution with Pb atoms it is possible to achieve reduction of a transient contact resistance rk in Bi85Sb15 solid solution - contact alloy interface.
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M. M. Tagiyev "Magnetothermoelectrical and adhesive properties of commutation contacts of thermoelements on the basis of extruded samples of Bi85Sb15 solid solution", Proc. SPIE 5126, 17th International Conference on Photoelectronics and Night Vision Devices, (30 September 2003); https://doi.org/10.1117/12.523890
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