28 August 2003 Automatic inspection tool sensitivity with characterization of AAPSM defects
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Proceedings Volume 5130, Photomask and Next-Generation Lithography Mask Technology X; (2003) https://doi.org/10.1117/12.504204
Event: Photomask and Next Generation Lithography Mask Technology X, 2003, Yokohama, Japan
Abstract
As AAPSM becomes more widely utilized, the need for defect inspection sensitivity becomes more critical. In addition, accurate defect characterization must be performed to encompass new effects caused by glass defects. Historically, defect size and position have been the two characteristics that were examined when determining inspection tool sensitivity. Because of the nature of AAPSM defects, phase is a factor that must be taken into account. This experiment utilizes two distinct forms of defect characterization -- SEM sizing, and surface profilometry. Programmed defect test masks were manufactured for phase shifting properties at both 248nm and 193nm exposure wavelengths. The defects were also etched at multiple depths resulting in a variety of phase angle errors. Utilizing the two characterization methods mentioned above, the automatic defect inspection tool's sensitivity on multiple programmed defects will be investigated.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Darren Taylor, Eric Poortinga, Bryan W. Reese, Blake C. Gibson, "Automatic inspection tool sensitivity with characterization of AAPSM defects", Proc. SPIE 5130, Photomask and Next-Generation Lithography Mask Technology X, (28 August 2003); doi: 10.1117/12.504204; https://doi.org/10.1117/12.504204
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