28 August 2003 Implementation of SMIF in reticle production for front-end processes: impact on yield
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Proceedings Volume 5130, Photomask and Next-Generation Lithography Mask Technology X; (2003) https://doi.org/10.1117/12.504278
Event: Photomask and Next Generation Lithography Mask Technology X, 2003, Yokohama, Japan
To improve the first pass defect level in a process, the implementation of a full Standard Machine Interface (SMIF) material handling system in first-level front end processes is a very effective method, due to the reduction of handling and clean-room particles on masks. The justification of such an investment into SMIF equipment is the corresponding increase in yield. Verification of this yield increase was done with data from Infineon maskhouse. Since the implementation was performed stepwise, a detailed defect data analysis had to be done. The total observed defect related yield enhancement SMIF implementation phase of approximately one year for the first level, was in the range of ~ 20%. To distinguish SMIF related improvements from other defect yield improvements during this time, the overall defect related yield was broken down into single process yields. The single process yield enhancements were calculated only with defects originating from particles at these process steps. The particle performance of SMIF pods was tested since the masks are put in the pods with chrome side up. Compared to conventional box types the particle adders due to pod handling on the masks in the SMIF pods was very low.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Renatus Sikorski, Renatus Sikorski, Annett Graeser, Annett Graeser, } "Implementation of SMIF in reticle production for front-end processes: impact on yield", Proc. SPIE 5130, Photomask and Next-Generation Lithography Mask Technology X, (28 August 2003); doi: 10.1117/12.504278; https://doi.org/10.1117/12.504278


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