Paper
12 November 1984 Vibration Sensor Using Planar Integrated Interferometric Circuit On Oxidised Silicon Substrate
P. Gidon, S. Valette, P. Schweizer
Author Affiliations +
Proceedings Volume 0514, 2nd Intl Conf on Optical Fiber Sensors: OFS'84; (1984) https://doi.org/10.1117/12.945078
Event: 2nd International Conference on Optical Fiber Sensors, 1984, Stuttgart, Germany
Abstract
We present the first test of a planar integrated optical interferome-trer used as a microdisplacement or vibration sensor. A schematic diagram of this device is shown figure 1. Essentially, it is a Michelson interferometer achieved with our classical planar structure Si/SiO2/Si3N4/SiO2 [1-2] including : . the grating coupler operating in the third order (period = 2μm) ; . the beam splitter, achieved by local etching of the SiO2 over-layer ; . two mirrors also obtained by etching of the silica followed by an aluminium deposition, in order to lower the T.I.R.* angle ; . and two cleaved faces.
© (1984) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
P. Gidon, S. Valette, and P. Schweizer "Vibration Sensor Using Planar Integrated Interferometric Circuit On Oxidised Silicon Substrate", Proc. SPIE 0514, 2nd Intl Conf on Optical Fiber Sensors: OFS'84, (12 November 1984); https://doi.org/10.1117/12.945078
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Cited by 8 scholarly publications.
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KEYWORDS
Sensors

Mirrors

Interferometry

Etching

Integrated circuit design

Integrated circuits

Silica

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