Paper
30 May 2003 Residual stress measurement using a radial in-plane speckle interferometer and laser annealing: preliminary results
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Abstract
This paper presents a combined system based on digital speckle pattern interferometry and laser annealing to determine residual stresses in ductile materials. The system allows the measurement of the radial in-plane displacement field generated when a specimen subjected to residual stresses is locally heated. This novel approach for measuring residual stresses has the advantage of being nondestructive and can be easily applied to in situ tests. The description of the combined system is followed by the presentation of preliminary results which illustrate the ability of both techniques to identify residual stress fields and also to determine their principal directions.
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Matias R. Viotti, Ricardo Suterio, Armando Albertazzi Jr., and Guillermo H. Kaufmann "Residual stress measurement using a radial in-plane speckle interferometer and laser annealing: preliminary results", Proc. SPIE 5144, Optical Measurement Systems for Industrial Inspection III, (30 May 2003); https://doi.org/10.1117/12.488195
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KEYWORDS
Interferometers

Annealing

Mirrors

Speckle

Phase shift keying

Nondestructive evaluation

Fringe analysis

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