10 November 2003 High-speed interchip optical interconnect based on diffractive optics
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The optical part of a high-speed, inter-chip optical interconnection scheme was tested. In the scheme, electronic data processing units are interconnected by laser beams via a transparent substrate. All the electronic and optoelectronic chips are mounted on one side of the transparent substrate, reflective diffractive optical elements for shaping and deflecting the laser beams located on the other side. To both allow close packing of VCSELs and low reflection losses, physically the transparent substrate is made-up of a thinner quartz plate positioned on top of and in direct contact with a thicker one. The insertion loss on imaging a VCSEL-simulating point source located on the upper side of the substrate onto an 8 mm laterally displaced position on the same side of the substrate via transmission through the substrate was found to be ~10 dB.
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Anders Magnusson, Anders Magnusson, Sverker Hard, Sverker Hard, } "High-speed interchip optical interconnect based on diffractive optics", Proc. SPIE 5181, Wave Optics and Photonic Devices for Optical Information Processing II, (10 November 2003); doi: 10.1117/12.502390; https://doi.org/10.1117/12.502390

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