3 November 2003 Resist hardening without surface deviation
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We report on a novel technique for hardening micro-optical resist elements, like beam-shaping elements or micro lenses, with large profile depths before proportional transfer into the fused silica substrate. This technique allows to harden the resist with only small distorsions of the height profile. For demonstration a refractive beam shaper was designed and fabricated in photo-resist using gray-tone lithography. This element was transfered into fused silica with high etch rates using an optimized set of parameters in an ICP-etcher.
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Holger Hartung, Holger Hartung, Matthias Cumme, Matthias Cumme, Mike Thieme, Mike Thieme, Ernst-Bernhard Kley, Ernst-Bernhard Kley, Andreas Tuennermann, Andreas Tuennermann, } "Resist hardening without surface deviation", Proc. SPIE 5183, Lithographic and Micromachining Techniques for Optical Component Fabrication II, (3 November 2003); doi: 10.1117/12.505797; https://doi.org/10.1117/12.505797

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