3 November 2003 Resist hardening without surface deviation
Author Affiliations +
Abstract
We report on a novel technique for hardening micro-optical resist elements, like beam-shaping elements or micro lenses, with large profile depths before proportional transfer into the fused silica substrate. This technique allows to harden the resist with only small distorsions of the height profile. For demonstration a refractive beam shaper was designed and fabricated in photo-resist using gray-tone lithography. This element was transfered into fused silica with high etch rates using an optimized set of parameters in an ICP-etcher.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Holger Hartung, Matthias Cumme, Mike Thieme, Ernst-Bernhard Kley, Andreas Tuennermann, "Resist hardening without surface deviation", Proc. SPIE 5183, Lithographic and Micromachining Techniques for Optical Component Fabrication II, (3 November 2003); doi: 10.1117/12.505797; https://doi.org/10.1117/12.505797
PROCEEDINGS
8 PAGES


SHARE
RELATED CONTENT


Back to Top