19 February 2004 Low cost uncooled IRFPA and molded IR lenses for enhanced driver vision
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Abstract
Uncooled infrared focal plane arrays are being developed for a wide range of thermal imaging applications. CEA / LETI developments are focused on the improvement of their sensitivity enabling the possibility to reduce the pixel pitch in order to decrease the total system cost by using smaller optics. We present the characterization of a 160 x 120 infrared focal plane array with a pixel pitch of 35 μm. The amorphous silicon based technology is the latest one developed by CEA / LETI and transferred to ULIS. ULIS developed for this device a low cost package based on existing technologies. The readout integrated circuit structure is using an advanced skimming function to enhance the pixel signal exploitation. This device is well adapted to high volume infrared imaging applications where spatial resolution is less important than device cost. The electro-optical characterization is presented. Besides, A unique and high precision molding technology has been developed by Umicore IR Glass to produce low cost chalcogenide infrared glass lenses with a high performance level. Spherical, aspherical and asphero-diffractive lenses have been manufactured with very accurate surface precision. The performances are comparable to those of an optic made with aspherical germanium. This new glass named GASIR2 offers an alternative solution to germanium for thermal imaging, especially for medium and high volumes applications. These two key technologies are well adapted to develop infrared enhanced driver vision (EDV) system for commercial application. A European project named ICAR has been setting up to exploit these advantages. An overview of the project will be given.
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Arnaud Crastes, Jean-Luc Tissot, Yann M. Guimond, Pier Claudio Antonello, Joel Leleve, Hans-Joachim Lenz, Pierre Potet, Jean-Jacques Yon, "Low cost uncooled IRFPA and molded IR lenses for enhanced driver vision", Proc. SPIE 5251, Detectors and Associated Signal Processing, (19 February 2004); doi: 10.1117/12.517152; https://doi.org/10.1117/12.517152
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