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2 September 2003 Simulation of silicon micromachined ultrasonic transducers
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Proceedings Volume 5253, Fifth International Symposium on Instrumentation and Control Technology; (2003) https://doi.org/10.1117/12.521356
Event: Fifth International Symposium on Instrumentation and Control Technology, 2003, Beijing, China
Abstract
A general 3-D TDK model developed further in this paper has been successfully applied to simulate a surface micromachined electrostatic or capacitive ultrasonic transducer with vacuum-sealed air-cavities (i.e. cMUT). Also, the paper gives a reliable prediction of resonant and anti-resonant frequencies of a typical cMUT.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Li-Feng Ge "Simulation of silicon micromachined ultrasonic transducers", Proc. SPIE 5253, Fifth International Symposium on Instrumentation and Control Technology, (2 September 2003); https://doi.org/10.1117/12.521356
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