3D analysis of defects in integrated circuits by one-photon optical-beam-induced current imaging and laser confocal reflectance microscopy

Jelda Jayne Miranda; Caesar Saloma

doi:10.1117/12.546234

4 December 2003 3D analysis of defects in integrated circuits by one-photon optical- beam-induced current imaging and laser confocal reflectance microscopy

Jelda Jayne Miranda, Caesar Saloma

Author Affiliations +

Proceedings Volume 5255, Biomolecular Photonics and Multidimensional Microscopy; (2003) https://doi.org/10.1117/12.546234
Event: Biomolecular Photonics and Multidimensional Microscopy, 2003, Wuhan, China

Abstract

Three-dimensional analysis is performed on defects found in an integrated circuit from high-contrast images that are obtained via an inexpensive technique that combines confocal reflectance microscopy with one-photon optical beam-induced current (1P-OBIC) imaging. The same focused beam simultaneously produces the 1P-OBIC and reflectance signals from the illuminated spot. Exclusive 3D distributions of the metal and semiconductor sites in the vicinity of defects caused by electrical overstress (decrease in OBIC current) and unwanted formation of generation centers (increase in OBIC current), reveal features which are difficult to isolate with confocal or 1P-OBIC microscopy alone.

Citation Download Citation

Jelda Jayne Miranda and Caesar Saloma "3D analysis of defects in integrated circuits by one-photon optical- beam-induced current imaging and laser confocal reflectance microscopy", Proc. SPIE 5255, Biomolecular Photonics and Multidimensional Microscopy, (4 December 2003); https://doi.org/10.1117/12.546234

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