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17 December 2003 Mask cost and specification
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Abstract
At the panel discussion of Photomask Japan 2003, we discussed about Mask cost and specification. The topics are (1) Mask price trend and its impact, (2) How to reduce the mask costs; solutions from a mask shop, mask writing tool and mask inspection tool 3) Partnering mask suppliers with mask users; reasonable mask specification and OPC strategies. The choice of DUV laser writer instead of e-beam writer is one solution for reduction of mask cost. The continuous improvement of e-beam writer and resist sensitivity for high throughput is another solution. The partnership between designer, EDA vender, mask maker and wafer lithographer becomes more important.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Hisashi Watanabe and Iwao Higashikawa "Mask cost and specification", Proc. SPIE 5256, 23rd Annual BACUS Symposium on Photomask Technology, (17 December 2003); https://doi.org/10.1117/12.537878
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