Translator Disclaimer
27 February 2004 Solving a layout design problem by analytic hierarchy process (AHP) and data envelopment analysis (DEA) approach
Author Affiliations +
Proceedings Volume 5262, Environmentally Conscious Manufacturing III; (2004) https://doi.org/10.1117/12.518054
Event: Photonics Technologies for Robotics, Automation, and Manufacturing, 2003, Providence, RI, United States
Abstract
Today, growing amounts of waste due to fast consumption rate of products started an irreversible environmental pollution and damage. A considerable part of this waste is caused by packaging material. With the realization of this fact, various waste policies have taken important steps. Here we considered a firm, where waste Aluminum constitutes majority of raw materials for this fir0m. In order to achieve a profitable recycling process, plant layout should be well designed. In this study, we propose a two-step approach involving Analytic Hierarchy Process (AHP) and Data Envelopment Analysis (DEA) to solve facility layout design problems. A case example is considered to demonstrate the results achieved.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Umut Rifat Tuzkaya, Arzum Eser, and Goner Argon "Solving a layout design problem by analytic hierarchy process (AHP) and data envelopment analysis (DEA) approach", Proc. SPIE 5262, Environmentally Conscious Manufacturing III, (27 February 2004); https://doi.org/10.1117/12.518054
PROCEEDINGS
8 PAGES


SHARE
Advertisement
Advertisement
RELATED CONTENT

Bidding-based autonomous process planning and scheduling
Proceedings of SPIE (August 27 1995)
Effective placement of chips on a shuttle mask
Proceedings of SPIE (August 27 2003)
2D layout computer-aided system
Proceedings of SPIE (March 21 1996)
FIPS IQIS a new program system for image processing...
Proceedings of SPIE (November 22 1994)

Back to Top