30 March 2004 AC-coupled interconnect for high-density high-bandwidth packaging
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AC Coupled Interconnection (ACCI), in conjunction with buried solder bump technology, provides a method to achieve signal I/O pitches of less than 100 μm and signaling rates greater than 3 Gbps per I/O on integrated circuits, while preserving excellent signal integrity. This paper presents a summary of approaches and status capacitive and inductive versions of AC Coupled Interconnect Systems.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Paul D Franzon, Paul D Franzon, Stephen Mick, Stephen Mick, John M. Wilson, John M. Wilson, Lei Luo, Lei Luo, Karthik Chandrasakhar, Karthik Chandrasakhar, } "AC-coupled interconnect for high-density high-bandwidth packaging", Proc. SPIE 5274, Microelectronics: Design, Technology, and Packaging, (30 March 2004); doi: 10.1117/12.528076; https://doi.org/10.1117/12.528076

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