2 April 2004 Micro hot embossing for high-aspect-ratio structure with materials flow enhancement by polymer sheet
Author Affiliations +
Abstract
Nano imprinting or Nano embossing process have been introduced to fabricate semiconductor, optical device and Micro Electro Mechanical Systems (MEMS) and the Nano Electro Mechanical Systems (NEMS) to reduce the fabrication cost. In our previous paper, micro hot embossing of Polycarbonate (PC) and Polyetheretherketone (PEEK) for optical switch with 8x8 mirrors was reported. The PC and PEEK sheets were embossed at elevated temperature with an embossing machine designed for the MEMS. In the application, the mirrors on the optical switch had some defects, such as slump, sticking and step at side of the mirror, due to embossing process and process conditions. These defects are attributed to the poor materials flow of plastics into the e Ni mold cavity of complicate shape with different aspect ratio. Therefore, the micro hot embossing is optimized in this paper with PTFE sheet to enhance the materials flow. In this paper, the PC and the PEEK sheets, thickness of 300um, are embossed at elevated temperature with the hot embossing machine with a Nickel mold. To control material flow of the PC or the PEEK sheets, Polytetrafluoroethylene (PTFE) sheet, the thickness of 100um, is placed on the PC or the PEEK sheets at elevated temperature. Mirror shape was transferred with better fidelity on the PC and PEEK sheet, and the thickness of cantilever became thinner than previous embossed structure without the PTFE. Especially, the mirror height and the thickness of cantilever on the PC have been improved at lower embossing temperature.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yoichi Murakoshi, Yoichi Murakoshi, Xue-Chuan Shan, Xue-Chuan Shan, Toshio Sano, Toshio Sano, Masaharu Takahashi, Masaharu Takahashi, Ryutaro Maeda, Ryutaro Maeda, } "Micro hot embossing for high-aspect-ratio structure with materials flow enhancement by polymer sheet", Proc. SPIE 5276, Device and Process Technologies for MEMS, Microelectronics, and Photonics III, (2 April 2004); doi: 10.1117/12.522898; https://doi.org/10.1117/12.522898
PROCEEDINGS
8 PAGES


SHARE
Back to Top