Paper
1 June 2004 The influence of the position accuracy of a laser diode and the influence of the top copper layer thickness on the temperature distribution of the single emitter in connection with an active cooled heat-sink
Ingo Baumeister, Karsten Schmidt, Ken Credle Jr., Trevor R. Crum
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Abstract
Computer simulation was done to determine the effect of the position of a laser diode bar on a laser diode cooler compared to the effect of changing the thickness of the top layer of copper on the laser diode cooler. The range of copper layer thicknesses tested was from 0.1mm to 1.4mm. The thicker the top layer, the better the thermal performance of the cooler up to 1.4mm. Above 1.4mm there was not measurably increased performance. The range of power input was 40W and 80W per bar. The position of the laser diode bar was only distinguishable at the 80W power level and the impractical top layer thicknesses of 0.1mm and 0.2mm, meaning that top layer thickness is much more important for improved thermal performance than the positioning of the bar on the cooler.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ingo Baumeister, Karsten Schmidt, Ken Credle Jr., and Trevor R. Crum "The influence of the position accuracy of a laser diode and the influence of the top copper layer thickness on the temperature distribution of the single emitter in connection with an active cooled heat-sink", Proc. SPIE 5336, High-Power Diode Laser Technology and Applications II, (1 June 2004); https://doi.org/10.1117/12.532042
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Cited by 1 scholarly publication.
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KEYWORDS
Semiconductor lasers

Temperature metrology

Copper

Diodes

Optical simulations

Computer simulations

Heatsinks

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