15 July 2004 Versatile light-control schemes based on diffractive optics for laser drilling, cutting, and joining technologies for microelectronic and micromechanical components and devices
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Proceedings Volume 5339, Photon Processing in Microelectronics and Photonics III; (2004); doi: 10.1117/12.527853
Event: Lasers and Applications in Science and Engineering, 2004, San Jose, Ca, United States
Abstract
Indispensable in laser-processing applications is an accurate and efficient delivery of light energy to process points. For mass production, multi-beam parallel processing is a must to gain high throughput. Diffractive optics is a competitive and cost-effective solution to achieve these goals. A diffractive optical element (DOE) is able to offer various light-control functions such as focusing, splitting and shaping according to the user’s requests. These elements can be utilized in a compact and convenient optical system. Thus laser-processing technologies using diffractive optics can be easily brought into manufacturing settings. We present four laser-based processes, each of which adopts diffractive optics in a distinctive way. They are 1) laser drilling of silicon wafers using a diffractive array illuminator to form microcavities for inkjet printers, 2) laser cutting of metal films using a diffractive focusator to produce liquid-crystal display panels for mobile phones, 3) laser soldering of quartz oscillators using a diffractive beam duplicator onto printed circuits set in wristwatches, and 4) laser sealing of packages using diffraction patterns to house electronic components therein. Some of these processes are at work routinely in our manufacturing plants.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jun Amako, Tatsuya Shimoda, Kazushige Umetsu, "Versatile light-control schemes based on diffractive optics for laser drilling, cutting, and joining technologies for microelectronic and micromechanical components and devices", Proc. SPIE 5339, Photon Processing in Microelectronics and Photonics III, (15 July 2004); doi: 10.1117/12.527853; https://doi.org/10.1117/12.527853
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KEYWORDS
Beam splitters

Laser cutting

Laser applications

Electrodes

Laser processing

Semiconducting wafers

Diffraction

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