30 December 2003 BCB wafer bonding for microfluidics
Author Affiliations +
Proceedings Volume 5342, Micromachining and Microfabrication Process Technology IX; (2003) https://doi.org/10.1117/12.524621
Event: Micromachining and Microfabrication, 2004, San Jose, California, United States
In this paper we show that BCB wafer bonding, combined with deep-reactive-ion-etching (DRIE) for silicon, and HF etching for FOTURAN glass are viable methods to fabricate three-dimensional microfluidics. The BCB film is patterned by dry-etching technique with a photoresist mask and the target wafer is then bulk-micromachined together with the BCB mask. The two micromachined wafers are then bonded together under vacuum or nitrogen gas environment, at low temperature. Silicon-glass, silicon-silicon and glass-glass are all possible bonding pairs using thermocompressive bonding with BCB. It was found that hard-cured BCB bonding is more suitable for microfluidic channel fabrications than soft-cured BCB bonding, due to adhesive overflows in microfluidic channels and delamination during wet etching.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Taejoo Hwang, Taejoo Hwang, Dan Popa, Dan Popa, Jeongsik Sin, Jeongsik Sin, Harry E. Stephanou, Harry E. Stephanou, Eric M. Leonard, Eric M. Leonard, } "BCB wafer bonding for microfluidics", Proc. SPIE 5342, Micromachining and Microfabrication Process Technology IX, (30 December 2003); doi: 10.1117/12.524621; https://doi.org/10.1117/12.524621

Back to Top