30 December 2003 BCB wafer bonding for microfluidics
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Proceedings Volume 5342, Micromachining and Microfabrication Process Technology IX; (2003) https://doi.org/10.1117/12.524621
Event: Micromachining and Microfabrication, 2004, San Jose, California, United States
Abstract
In this paper we show that BCB wafer bonding, combined with deep-reactive-ion-etching (DRIE) for silicon, and HF etching for FOTURAN glass are viable methods to fabricate three-dimensional microfluidics. The BCB film is patterned by dry-etching technique with a photoresist mask and the target wafer is then bulk-micromachined together with the BCB mask. The two micromachined wafers are then bonded together under vacuum or nitrogen gas environment, at low temperature. Silicon-glass, silicon-silicon and glass-glass are all possible bonding pairs using thermocompressive bonding with BCB. It was found that hard-cured BCB bonding is more suitable for microfluidic channel fabrications than soft-cured BCB bonding, due to adhesive overflows in microfluidic channels and delamination during wet etching.
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Taejoo Hwang, Taejoo Hwang, Dan Popa, Dan Popa, Jeongsik Sin, Jeongsik Sin, Harry E. Stephanou, Harry E. Stephanou, Eric M. Leonard, Eric M. Leonard, } "BCB wafer bonding for microfluidics", Proc. SPIE 5342, Micromachining and Microfabrication Process Technology IX, (30 December 2003); doi: 10.1117/12.524621; https://doi.org/10.1117/12.524621
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