You have requested a machine translation of selected content from our databases. This functionality is provided solely for your convenience and is in no way intended to replace human translation. Neither SPIE nor the owners and publishers of the content make, and they explicitly disclaim, any express or implied representations or warranties of any kind, including, without limitation, representations and warranties as to the functionality of the translation feature or the accuracy or completeness of the translations.
Translations are not retained in our system. Your use of this feature and the translations is subject to all use restrictions contained in the Terms and Conditions of Use of the SPIE website.
30 December 2003Deep reactive ion etch conditioning recipe
Deep Reactive Ion Etch (DRIE) has historically been regarded as a process possessing inherent variable response. These varying responses include etch rate, mask selectivity, etch depth uniformity across the wafer, and the overall profile of the features being etched. Several factors are thought to lend themselves to this observed variation. Among them are process temperature disparities and residual parasitic compounds within the reaction chamber itself.
A long term experiment was carried out to examine the statistical difference between DRIE runs with and without a specially defined pre-process conditioning recipe. This recipe was developed with the expectations of serving a twofold effect: the first serving as a “warm-up” of the process chamber to a steady state temperature, and the second being a stripping of residual organic compounds within the chamber that might otherwise add variance to the following DRIE process. The pre-process recipe has duration of ~30 minutes. The results of the experiment performed will clearly show that this conditioning recipe run prior to processing reduces the typical variance of DRIE processing.
The alert did not successfully save. Please try again later.
Matthew Wasilik, Ning Chen, "Deep reactive ion etch conditioning recipe," Proc. SPIE 5342, Micromachining and Microfabrication Process Technology IX, (30 December 2003); https://doi.org/10.1117/12.522941