23 December 2003 A new sensor for trench depth monitoring: the TDM 200
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Proceedings Volume 5343, Reliability, Testing, and Characterization of MEMS/MOEMS III; (2003) https://doi.org/10.1117/12.529023
Event: Micromachining and Microfabrication, 2004, San Jose, California, United States
Abstract
A New Polarimetric method for trench depth monitoring in micromachining applications is presented. As compared to the previous innovative and patented Twin-Spot interferometric technique developed by the Thin Film Division of Jobin Yvon, this new method allows an absolute and accurate trench depth monitoring suitable for Bosch process with no external triggering.
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Pascal Amary, Denis Cattelan, Jean-Paul Gaston, Bernard Kaplan, Eric Teboul, "A new sensor for trench depth monitoring: the TDM 200", Proc. SPIE 5343, Reliability, Testing, and Characterization of MEMS/MOEMS III, (23 December 2003); doi: 10.1117/12.529023; https://doi.org/10.1117/12.529023
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