23 December 2003 Assembly process issues and reliability in microsystem packaging
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Proceedings Volume 5343, Reliability, Testing, and Characterization of MEMS/MOEMS III; (2003) https://doi.org/10.1117/12.531901
Event: Micromachining and Microfabrication, 2004, San Jose, California, United States
Abstract
Microsystem packages and package assembly processes have an enormous influence on the ability to successfully bring a microsystem product to market. Package and assembly processes can introduce both performance and reliability issues which can introduce significant delays in the product engineering cycle. Typically, thousands of devices must be made and tested to fully quantify the reliability of a microsystem product. While most microsystem products use package and package assembly technology adapted from the integrated circuit industry, the unique aspects of these devices requires unique package designs and unique implementation of the unit assembly processes. This paper discusses many of these unit processes, their adaptation to microsystem applications and the reliability issues that can be traced back to these processes. Solutions to these package assembly issues will also be presented.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Leland Spangler, "Assembly process issues and reliability in microsystem packaging", Proc. SPIE 5343, Reliability, Testing, and Characterization of MEMS/MOEMS III, (23 December 2003); doi: 10.1117/12.531901; https://doi.org/10.1117/12.531901
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