Translator Disclaimer
Paper
23 December 2003 Fabrication and characterization of high-Q microresonators using thin plate mechanical mode
Author Affiliations +
Proceedings Volume 5343, Reliability, Testing, and Characterization of MEMS/MOEMS III; (2003) https://doi.org/10.1117/12.524751
Event: Micromachining and Microfabrication, 2004, San Jose, California, United States
Abstract
The growing place of electronics devices in our society increases the demand of small devices such as RF filters, time references and oscillators. The aim of this work concerns the design and characterization of a new kind of crystalline silicon microresonator fabricated using a DRIE (Deep Reactive Ion Etching) technique. This device can be fabricated by IC compatible techniques. This kind of microresonators is electrostatically actuated and uses a contour or Lamé mode as fundamental mode of vibration. Its size gives the resonant frequency and behavior. The mechanical characterization of one microresonator is carried out using an optical bench set-up. The first results obtained on a device show a high Q factor in air close to 1000 at the resonant frequency of 10.3 MHz.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jean-Rene Coudevylle, Skandar Basrour, and Michel de Labachelerie "Fabrication and characterization of high-Q microresonators using thin plate mechanical mode", Proc. SPIE 5343, Reliability, Testing, and Characterization of MEMS/MOEMS III, (23 December 2003); https://doi.org/10.1117/12.524751
PROCEEDINGS
11 PAGES


SHARE
Advertisement
Advertisement
Back to Top