23 December 2003 MEMS/MOEMS failure location and characterization methods: the micromirror device
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Proceedings Volume 5343, Reliability, Testing, and Characterization of MEMS/MOEMS III; (2003) https://doi.org/10.1117/12.524104
Event: Micromachining and Microfabrication, 2004, San Jose, California, United States
Abstract
The purpose of this paper is to illustrate the approaches used to determine the location, character, and origin of failed superstructure elements within the Digital Micromirror Device and relationally to other types of MEMS and MOEMS devices. Since the Digital Micromirror Device is a very large field of movable mirrors that are essentially identical in appearance, some of those methods will include the uses of: failure mapping, digital imaging techniques, and explanations of precautions needed to ensure the result of the analysis is a correct answer to the questions asked.
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Cary O. Davis, Cary O. Davis, } "MEMS/MOEMS failure location and characterization methods: the micromirror device", Proc. SPIE 5343, Reliability, Testing, and Characterization of MEMS/MOEMS III, (23 December 2003); doi: 10.1117/12.524104; https://doi.org/10.1117/12.524104
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