Novel low coherence metrology for nondestructive characterization of high aspect ratio micro-fabricated and micro-machined structures

Wojciech Walecki; Frank Wei; Phuc Van; Kevin Lai; Tim Lee; S. H. Lau; Ann Koo

doi:10.1117/12.530749

23 December 2003 Novel low coherence metrology for nondestructive characterization of high-aspect-ratio microfabricated and micromachined structures

Wojciech Walecki; Frank Wei; Phuc Van; Kevin Lai; Tim Lee; S. H. Lau; Ann Koo

Author Affiliations +

Proceedings Volume 5343, Reliability, Testing, and Characterization of MEMS/MOEMS III; (2003) https://doi.org/10.1117/12.530749
Event: Micromachining and Microfabrication, 2004, San Jose, California, United States

Abstract

Novel nondestructive method based on low coherence optical interferometry for measurement of deep etched trenches in MEMs structures is presented. The proposed technique proves to provide very reproducible results and can be easily extended to metrology of other materials such as metals and dielectrics. We present results in real life semiconductor structures and discuss practical and fundamental limits of this technique

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Wojciech Walecki, Wojciech Walecki, Frank Wei, Frank Wei, Phuc Van, Phuc Van, Kevin Lai, Kevin Lai, Tim Lee, Tim Lee, S. H. Lau, S. H. Lau, Ann Koo, Ann Koo, } "Novel low coherence metrology for nondestructive characterization of high-aspect-ratio microfabricated and micromachined structures", Proc. SPIE 5343, Reliability, Testing, and Characterization of MEMS/MOEMS III, (23 December 2003); doi: 10.1117/12.530749; https://doi.org/10.1117/12.530749

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