23 December 2003 Reliable vacuum packaging using NanoGetters and glass frit bonding
Author Affiliations +
Proceedings Volume 5343, Reliability, Testing, and Characterization of MEMS/MOEMS III; (2003) https://doi.org/10.1117/12.530414
Event: Micromachining and Microfabrication, 2004, San Jose, California, United States
A new approach to vacuum packaging micromachined resonant, tunneling, and display devices will be covered in this paper. A multi-layer, thin-film getter, called a NanoGetter, which is particle free and does not increase the chip size of the microsystem has been developed and integrated into conventional wafer-to-wafer bonding processes. Experimental data taken with chip-scale packages using glass frit bonding between the Pyrex and silicon wafers, has resulted in silicon resonators in which Q values in excess of 37,000 have been obtained. Reliability data for vacuum-sealed diaphragms and resonators will be presented. Unlike previous reliability studies without getters, no degradation in Q has been noted with NanoGetter parts after extended high temperature storage. Applications for this technology include gyroscopes, accelerometers, displays, flow sensors, density meters, IR sensors, microvacuum tubes, RF-MEMS, pressure sensors and other vacuum sealed devices.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Douglas Sparks, Douglas Sparks, Sonbol Massoud-Ansari, Sonbol Massoud-Ansari, Nader Najafi, Nader Najafi, } "Reliable vacuum packaging using NanoGetters and glass frit bonding", Proc. SPIE 5343, Reliability, Testing, and Characterization of MEMS/MOEMS III, (23 December 2003); doi: 10.1117/12.530414; https://doi.org/10.1117/12.530414


Back to Top