23 December 2003 Torsional stress, fatigue and fracture strength in silicon hinges of a micro scanning mirror
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Proceedings Volume 5343, Reliability, Testing, and Characterization of MEMS/MOEMS III; (2003) https://doi.org/10.1117/12.524872
Event: Micromachining and Microfabrication, 2004, San Jose, California, United States
Abstract
Special micro scanning mirrors have been designed for the investigation of torsional stress in micro-scale hinges made of crystalline silicon. The setup with precise logging of resonant frequency and deflection amplitude of the MEMS-scanners is described. First results on fatigue and fracture strength are presented. Fracture of torsion beams with 6.6 μm x 30 μm cross-section occurred at 2.0 GPa to 2.4 GPa. No sign of fatigue was observed in operation for 512 h at 1.4 GPa torsional stress in resonance at 2260.7 Hz oscillation frequency. Measured frequency variation was 0.06% without any trend.
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Alexander Wolter, Alexander Wolter, Harald Schenk, Harald Schenk, Hilmar Korth, Hilmar Korth, Hubert Lakner, Hubert Lakner, } "Torsional stress, fatigue and fracture strength in silicon hinges of a micro scanning mirror", Proc. SPIE 5343, Reliability, Testing, and Characterization of MEMS/MOEMS III, (23 December 2003); doi: 10.1117/12.524872; https://doi.org/10.1117/12.524872
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