Hot embossing: a flexible and successful replication technology for polymer MEMS

Mathias Heckele

doi:10.1117/12.537197

23 December 2003 Hot embossing: a flexible and successful replication technology for polymer MEMS

Mathias Heckele

Proceedings Volume 5345, Microfluidics, BioMEMS, and Medical Microsystems II; (2003) https://doi.org/10.1117/12.537197
Event: Micromachining and Microfabrication, 2004, San Jose, California, United States

Abstract

Molding of micro components from thermoplastic polymers has become a routinely used industrial production process. Besides the famous injection molding technology hot embossing is nearly unknown to most people in micro technology. Initially developed for first feasibility tests with microstructured moldinserts hot embossing has been developed during the last ten years to a flexible and successful replication technology for polymer MEMS: Material screening, rapid prototyping but even small series with far more than 10.000 components has lead to a first commercialization of the related machinery. But also high end applications, difficult to realize with other technologies, are requested to replicate complex microstructures. This paper gives an overview about the development of this technique and presents some new developments.

Citation Download Citation

Mathias Heckele "Hot embossing: a flexible and successful replication technology for polymer MEMS", Proc. SPIE 5345, Microfluidics, BioMEMS, and Medical Microsystems II, (23 December 2003); https://doi.org/10.1117/12.537197

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