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24 January 2004 Artificial compound eyes: different concepts and their application for ultraflat image acquisition sensors
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Proceedings Volume 5346, MOEMS and Miniaturized Systems IV; (2004)
Event: Micromachining and Microfabrication, 2004, San Jose, California, United States
Two different approaches for ultra flat image acquisition sensors on the basis of artificial compound eyes are examined. In apposition optics the image reconstruction is based on moire or static sampling while the superposition eye approach produces an overall image. Both types of sensors are compared with respect to theoretical limitations of resolution, sensitivity and system thickness. Explicit design rules are given. A paraxial 3x3 matrix formalism is used to describe the arrangement of three microlens arrays with different pitches to find first order parameters of artificial superposition eyes. The model is validated by analysis of the system with raytracing software. Measurements of focal length of anamorphic reflow lenses, which are key components of the superposition approach, under oblique incidence are performed. For the second approach, the artificial apposition eye, a first demonstrator system is presented. The monolithic device consists of a UV-replicated reflow microlens array on a thin silica-substrate with a pinhole array in a metal layer on the backside. The pitch of the pinholes differs from the lens array pitch to enable an individual viewing angle for each channel. Imaged test patterns are presented and measurements of the angular sensitivity function are compared to calculations using commercial raytracing software.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jacques W Duparre, Peter Schreiber, Peter Dannberg, Toralf Scharf, Petri Pelli, Reinhard Voelkel, Hans-Peter Herzig, and Andreas Braeuer "Artificial compound eyes: different concepts and their application for ultraflat image acquisition sensors", Proc. SPIE 5346, MOEMS and Miniaturized Systems IV, (24 January 2004);

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