24 January 2004 Extrinsic Fabry-Perot pressure sensor using single deeply corrugated diaphragm technique
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Proceedings Volume 5346, MOEMS and Miniaturized Systems IV; (2004) https://doi.org/10.1117/12.516589
Event: Micromachining and Microfabrication, 2004, San Jose, California, United States
Abstract
In this study, an analytical model, taking into account the coupled photoelastic and thermal-optical effects, is established to evaluate the temperature dependence of a single-chip silicon micromachined Fabry-Perot pressure sensor. The results show that temperature variation has significant impact on the micromachined Fabry-Perot pressure sensor with conventional flat diaphragm. A new membrane-type silicon micromachined Fabry-Perot pressure sensor with a novel deeply corrugated diaphragm is then proposed. The sensor is fabricated on a single-chip using both surface- and bulk-micromachining techniques. Both analytical and experimental results show that the cross-sensitivity to temperature of Fabry-Perot pressure sensors, can be substantially alleviated by the proposed single deeply corrugated diaphragm/mirror.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
D. G. Guo, D. G. Guo, W. J. Wang, W. J. Wang, Rongming Lin, Rongming Lin, "Extrinsic Fabry-Perot pressure sensor using single deeply corrugated diaphragm technique", Proc. SPIE 5346, MOEMS and Miniaturized Systems IV, (24 January 2004); doi: 10.1117/12.516589; https://doi.org/10.1117/12.516589
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