24 January 2004 Extrinsic Fabry-Perot pressure sensor using single deeply corrugated diaphragm technique
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Proceedings Volume 5346, MOEMS and Miniaturized Systems IV; (2004) https://doi.org/10.1117/12.516589
Event: Micromachining and Microfabrication, 2004, San Jose, California, United States
Abstract
In this study, an analytical model, taking into account the coupled photoelastic and thermal-optical effects, is established to evaluate the temperature dependence of a single-chip silicon micromachined Fabry-Perot pressure sensor. The results show that temperature variation has significant impact on the micromachined Fabry-Perot pressure sensor with conventional flat diaphragm. A new membrane-type silicon micromachined Fabry-Perot pressure sensor with a novel deeply corrugated diaphragm is then proposed. The sensor is fabricated on a single-chip using both surface- and bulk-micromachining techniques. Both analytical and experimental results show that the cross-sensitivity to temperature of Fabry-Perot pressure sensors, can be substantially alleviated by the proposed single deeply corrugated diaphragm/mirror.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
D. G. Guo, D. G. Guo, W. J. Wang, W. J. Wang, Rongming Lin, Rongming Lin, } "Extrinsic Fabry-Perot pressure sensor using single deeply corrugated diaphragm technique", Proc. SPIE 5346, MOEMS and Miniaturized Systems IV, (24 January 2004); doi: 10.1117/12.516589; https://doi.org/10.1117/12.516589
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