24 January 2004 Modeling and simulation of fiber image guide multichip modules for MOEMS applications
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Proceedings Volume 5346, MOEMS and Miniaturized Systems IV; (2004) https://doi.org/10.1117/12.524853
Event: Micromachining and Microfabrication, 2004, San Jose, California, United States
Abstract
Densely integrated systems in the future will incorporate device and communication technologies that span the domains of digital and analog electronics, optics, micro-mechanics, and micro-fluidics. Given the fundamental differences in substrate materials, feature scale and processing requirements between integrated devices in these domains, it is likely that multi-chip, system-in-package, integration solutions will be required for the foreseeable future. The multi-domain nature of these systems necessitates design tools that span multiple energy domains, time and length scales, as well as abstraction levels. This paper describes a case study of the modeling of a photonic/multi-technology system based on a 3D volumetric packaging technology implemented with Fiber Image Guide (FIG) based technology. It is 64x64 fiber crossbar switch implementation using three Silicon-on-Sapphire mixed signal switch die with flip-chip bonded VCSEL and detector arrays. We show a single end-to-end system simulation of the O/E crossbar working across the domains of free-space and guided wave optical propagation, GaAs O/E and E/O devices, analog drivers and receivers and integrated digital control.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Steven P. Levitan, Steven P. Levitan, Timothy P Kurzweg, Timothy P Kurzweg, Jose A Martinez, Jose A Martinez, Mark A Kahrs, Mark A Kahrs, Jason Bakos, Jason Bakos, Craig Windish, Craig Windish, Jason Boles, Jason Boles, John Hansson, John Hansson, Michael Weisser, Michael Weisser, Charles Kuznia, Charles Kuznia, Donald M. Chiarulli, Donald M. Chiarulli, } "Modeling and simulation of fiber image guide multichip modules for MOEMS applications", Proc. SPIE 5346, MOEMS and Miniaturized Systems IV, (24 January 2004); doi: 10.1117/12.524853; https://doi.org/10.1117/12.524853
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