Paper
29 December 2003 Microfabrication technologies for missile components
Tracy Dean Hudson, Paul R. Ashley, Mark G. Temmen, Michael S. Kranz, Milan Buncick, Eric Tuck, Deanna K. McMillen
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Abstract
This invited communication presents the microfabrication technologies, and associated issues, being developed by the U.S. Army’s AMRDEC for missile components. Primary components are inertial sensors and radio frequency switches. Two inertial sensor types are discussed -- fiber optic and micro-electromechanical system (MEMS) gyroscopes. The RF switches are also based on MEMS technology and are a natural extension of the microfabrication processes developed for the MEMS gyroscope.
© (2003) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Tracy Dean Hudson, Paul R. Ashley, Mark G. Temmen, Michael S. Kranz, Milan Buncick, Eric Tuck, and Deanna K. McMillen "Microfabrication technologies for missile components", Proc. SPIE 5347, Micromachining Technology for Micro-Optics and Nano-Optics II, (29 December 2003); https://doi.org/10.1117/12.532616
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Cited by 1 scholarly publication.
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KEYWORDS
Microelectromechanical systems

Gyroscopes

Semiconducting wafers

Sensors

Microfabrication

Switches

Waveguides

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