Paper
8 April 2004 Evaluation of spatial resolution in laser-terahertz emission microscope for inspecting electrical faults in integrated circuits
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Abstract
We have proposed and demonstrated a nondestructive and non-contact inspection method for electrical faults using laser-Terahertz (THz) emission microscopy (LTEM). By measuring the position dependence of the amplitude of the THz emission from integrated circuits (IC) excited with femtosecond (fs) laser pulses, it is possible to investigate the electrical faults in IC. By improving the spatial resolution of the system, we successfully observed the THz emission image of a microprocessor on standby mode. The LTEM system has a spatial resolution about 3µm and it can localize electrically defective sites in the chip to within a ten square microns.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Masatsugu Yamashita, Toshihiko Kiwa, Masayoshi Tonouchi, and Kodo Kawase "Evaluation of spatial resolution in laser-terahertz emission microscope for inspecting electrical faults in integrated circuits", Proc. SPIE 5354, Terahertz and Gigahertz Electronics and Photonics III, (8 April 2004); https://doi.org/10.1117/12.528833
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Cited by 1 scholarly publication.
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KEYWORDS
Terahertz radiation

Spatial resolution

Inspection

Signal detection

Mirrors

Modulation

Integrated circuits

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