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Low-profile flat pack: a high-power fiber coupled laser diode package for low-cost high-reliability applications
Radiation mode coupling between active and passive chips based on a self-formed compact polymer interconnect for single-mode chip-to-chip optoelectronic integration
The fabrication of pyramid-shaped fiber microlenses for coupling the high-power diode lasers into the single-mode fibers
Flexible optical waveguide film with 45-degree micromirror couplers for hybrid E/O integration or parallel optical interconnection