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10 June 2004 Progress toward the development of manufacturable integrated optical data buses
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The drive to faster data transmission speeds, more integration, smaller form factors and higher signal integrity all favor the eventual adoption of optical transmission schemes in data buses. This contribution will discuss emerging technologies from Shipley Company, LLC to address the needs of optoelectronic signal transmission. In particular, the discussion will focus on materials and processes that are in development to function within existing printed circuit board (PCB) & microelectronic manufacturing schemes. One topic that is described in detail involves photo-patternable, polymer interconnect technologies. Another topic describes progress in Shipley’s ability to integrate these interconnects into prototypical PCB processes. Progress in connecting the planar waveguides to connectorization schemes will be also be described. Other topics include lithographic and patterning metrics, optical characteristics of interconnects, morphological features of patterned waveguides, integration and coupling considerations, thermal and mechanical properties of the system and general assembly processes..
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Nick Pugliano, Nancy Chiarroto, John Fisher, Noel Heiks, Tuan Ho, Garo Khanarian, Matthew Moynihan, Nathan Pawlowski, Jim Shelnut, David Sherrer, Bruno Sicard, and Hai-Bin Zheng "Progress toward the development of manufacturable integrated optical data buses", Proc. SPIE 5358, Photonics Packaging and Integration IV, (10 June 2004);

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