6 July 2004 Photonic interconnects to silicon chips
Author Affiliations +
Proceedings Volume 5359, Quantum Sensing and Nanophotonic Devices; (2004); doi: 10.1117/12.518315
Event: Integrated Optoelectronic Devices 2004, 2004, San Jose, CA, United States
Abstract
A multi-channel free-space micro-optical module for dense MCM-level optical interconnections has been designed and fabricated. Extensive modeling proves that the module is scalable with a potential for multi-Tb/s.cm2 aggregate bit rate capacity while alignment and fabrication tolerances are compatible with present-day mass replication techniques. The micro-optical module is an assembly of refractive lenslet-arrays and a high-quality micro-prism. Both components are prototyped using deep lithography with protons and are monolithically integrated using vacuum casting replication technique. The resulting 16-channel high optical-grade plastic module shows optical transfer efficiencies of 46% and inter-channel cross talks as low as -22 dB, sufficient to establish workable multi-channel MCM-level interconnections. This micro-optical module was used in a feasibility demonstrator to establish intra-chip optical interconnections on a 0.6μm CMOS opto-electronic field programmable gate array. This opto-electronic chip combines fully functional digital logic, driver and receiver circuitry and flip-chipped VCSEL and detector arrays. With this test-vehicle multichannel on-chip data-communication has been achieved for the first time to our knowledge. The bit rate per channel was limited to 10Mb/s because of the limited speed of the chip tester.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Christof Debaes, Michael Vervaeke, Valerie Baukens, Heidi Ottevaere, Pedro Vynck, Patrik Tuteleers, Bart Volckaerts, Wim Meeus, Marnix Brunfaut, Jan Van Campenhout, Alex Hermanne, Hugo Thienpont, "Photonic interconnects to silicon chips", Proc. SPIE 5359, Quantum Sensing and Nanophotonic Devices, (6 July 2004); doi: 10.1117/12.518315; https://doi.org/10.1117/12.518315
PROCEEDINGS
15 PAGES


SHARE
KEYWORDS
Vertical cavity surface emitting lasers

Optical interconnects

Tolerancing

Beam propagation method

Field programmable gate arrays

Optical alignment

Optoelectronics

Back to Top