Translator Disclaimer
25 June 2004 Towards roll-to-roll fabrication of electronics, optics, and optoelectronics for smart and intelligent packaging
Author Affiliations +
Embedding of optoelectrical, optical, and electrical functionalities into low-cost products like packages and printed matter can be used to increase their information content. These functionalities make also possible the realization of new type of entertaining, impressive or guiding effects on the product packages and printed matter. For these purposes, components like displays, photodetectors, light sources, solar cells, battery elements, diffractive optical elements, lightguides, electrical conductors, resistors, transistors, switching elements etc. and their integration to functional modules are required. Additionally, the price of the components for low-end products has to be in cent scale or preferably below that. Therefore, new, cost-effective, and volume scale capable manufacturing techniques are required. Recent developments of liquid-phase processable electrical and optical polymeric, inorganic, and hybrid materials - inks - have made it possible to fabricate functional electrical, optical and optoelectrical components by conventional roll-to-roll techniques such as gravure printing, embossing, digital printing, offset, and screen printing on flexible paper and plastic like substrates. In this paper, we show our current achievements in the field of roll-to-roll fabricated, optics, electronics and optoelectronics. With few examples, we also demonstrate the printing and hot-embossing capabilities of table scale printing machines and VTT Electronic's 'PICO' roll-to-roll pilot production facility.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Terho K. Kololuoma, Markus Tuomikoski, Tapio Makela, Jali Heilmann, Tomi Haring, Jani Kallioinen, Juha Hagberg, Ilkka Kettunen, and Harri K. Kopola "Towards roll-to-roll fabrication of electronics, optics, and optoelectronics for smart and intelligent packaging", Proc. SPIE 5363, Emerging Optoelectronic Applications, (25 June 2004);

Back to Top