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20 May 2004 Controlling template response during imprint lithography
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Abstract
Step-and-Flash Imprint Lithography (S-FILTM) is a principal candidate for the next-generation lithography at the 45-nm node (and below). In imprint lithography, a monomer solution is dispensed onto the wafer. The monomer fills small features in a template that is lowered onto the wafer. The monomer is cured, causing it to solidify so that a three-dimensional replica of the template features is produced and remains on the wafer after the template is removed. Because this is a one-to-one process, any distortions of the template during the squeezing process will be manifested directly as errors in the features that are imprinted on the substrate. A finite element (FE) structural model of the S-FIL template has been created to predict the distortions due to mounting, gravity, and the fluid pressure distribution that arises from the viscous flow of the polymer liquid during the imprint process. Distortions take the form of both in-plane and out-of-plane displacements. An axisymmetric, finite difference (FD) model is used to predict the pressure distribution over the template due to viscous flow and surface tension effects. The FE and FD models are coupled using an iterative process in which the pressure distribution and template distortions are calculated at progressing time intervals until the final, desired gap height is achieved, nominally 200 nm. The coupled models are capable of characterizing the fluid-structure interaction that occurs during the imprint process. The results of the model will facilitate the design of system components that are capable of meeting the stringent error budgets associated with the sub-45-nm nodes.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Scott D. Schuetter, Gerald A. Dicks, Greg F. Nellis, Roxann L. Engelstad, Edward G. Lovell, and Brad F. Schulteis "Controlling template response during imprint lithography", Proc. SPIE 5374, Emerging Lithographic Technologies VIII, (20 May 2004); https://doi.org/10.1117/12.546925
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