20 May 2004 Production of low-thermal-expansion EUVL mask blanks with low-defect multilayer, buffer, and absorber
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Schott Lithotec has introduced all relevant technology steps to manufacture EUV mask blanks - ranging from Low Thermal Expansion Material (LTEM) via high quality substrate polishing to low defect blank manufacturing. New polishing and cleaning technologies, improved sputter technology and updated metrology enable us to routinely produce EUVL mask blanks meeting already many of the roadmap requirements. The goal is pilot production of EUV blanks for the 45 nm node end of 2005. There are several technology options for achieving the mechanical, optical and chemical specs for substrates and coatings. Some of them are already integrated in our processes. An important focus of this paper is the understanding of defect sources starting from the LTEM bulk material to the fully coated blanks with multilayer, buffer and absorber. We present details on some production steps controlling defect detection sensitivity dedicated to various layers and report on new results on defect reduction research after the different process steps.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Frank Sobel, Lutz Aschke, Frauke Rueggeberg, Holger Seitz, Nathalie Olschewski, Torsten Reichhardt, Hans Becker, Markus Renno, Steffen Kirchner, Thomas Leutbecher, Guenter Hess, and Konrad Knapp "Production of low-thermal-expansion EUVL mask blanks with low-defect multilayer, buffer, and absorber", Proc. SPIE 5374, Emerging Lithographic Technologies VIII, (20 May 2004); doi: 10.1117/12.533292; https://doi.org/10.1117/12.533292


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