20 May 2004 Projection maskless lithography
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Abstract
Recent studies have shown the feasibility of Projection Mask-Less Lithography (PML2) for small and medium volume device production (2-5 WPH) for the 45nm technology node. This PML2 tool concept comprises a combined electrostatic-magnetic electron optical column with 200x de-magnification factor. Instead of a mask there is a programmable aperture plate enabling dynamic beam structuring. Wafer exposure is done stripe-by-stripe with a scanning 300mm wafer stage. Detailed calculations of the PML2 optical column (2-step demagnification) including Monte-Carlo simulations of Coulomb interactions are presented. The extendibility of PML2 technology for the 32nm node will be discussed.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Christoph Brandstatter, Christoph Brandstatter, Hans Loeschner, Hans Loeschner, Gerhard Stengl, Gerhard Stengl, Gertraud Lammer, Gertraud Lammer, Herbert Buschbeck, Herbert Buschbeck, Elmar Platzgummer, Elmar Platzgummer, Hans-Joachim Doring, Hans-Joachim Doring, Thomas Elster, Thomas Elster, Olaf Fortagne, Olaf Fortagne, } "Projection maskless lithography", Proc. SPIE 5374, Emerging Lithographic Technologies VIII, (20 May 2004); doi: 10.1117/12.535412; https://doi.org/10.1117/12.535412
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