24 May 2004 Dual side wafer metrology for micromachining applications
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Abstract
Advances in micromachining (MEMS) applications such as optical components, inertial and pressure sensors, fluidic pumps and radio frequency (RF) devices are driving lithographic requirements for tighter registration, improved pattern resolution and improved process control on both sides of the substrate. Consequently, there is a similar increase in demand for advanced metrology tools capable of measuring the Dual Side Alignment (DSA) performance of the lithography systems. There are a number of requirements for an advanced DSA metrology tool. First, the system should be capable of measuring points over the entire area of the wafer rather than a narrow area near the lithography alignment targets. Secondly, the system should be capable of measuring a variety of different substrate types and thicknesses. Finally, it should be able to measure substrates containing opaque deposited films such as metals. In this paper, the operation and performance of a new DSA metrology tool is discussed. The UltraMet 100 offers DSA registration measurement at greater than 90% of a wafer's surface area, providing a true picture of a lithography tool’s alignment performance and registration yield across the wafer. The system architecture is discussed including the use of top and bottom cameras and the pattern recognition system. Experimental data is shown for tool repeatability and reproducibility over time.
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Dan Schurz, Warren W. Flack, Doug Anberg, "Dual side wafer metrology for micromachining applications", Proc. SPIE 5375, Metrology, Inspection, and Process Control for Microlithography XVIII, (24 May 2004); doi: 10.1117/12.535928; https://doi.org/10.1117/12.535928
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