24 May 2004 Mask line monitor: process improvements and yield learning
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Abstract
With ever increasing linewidth challenges per technology changes, the mask manufacturing process becomes more and more difficult. The challenges can be separated into two categories: image size and defects. Mask inspection detects hard defects most likely caused somewhere in the mask manufacturing process. Defect partitioning highlights the hard defects sources. They range from pre-exposure mask blank handling to the cleanliness of the process tools. A test vehicle was designed to allow for mask manufacturing defect partitioning via a die-to-die inspection tool. The process changes implemented range from pre-write mask handling to tool modifications. The methodology used to determine the process induced defects and the yield gains by making the necessary process changes will be presented.
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Yiyang Jenny Wang, Andrew J Watts, "Mask line monitor: process improvements and yield learning", Proc. SPIE 5375, Metrology, Inspection, and Process Control for Microlithography XVIII, (24 May 2004); doi: 10.1117/12.536773; https://doi.org/10.1117/12.536773
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