Combinitorial resist processing studies

Carl E. Larson; Gregory M. Wallraff

doi:10.1117/12.538684

14 May 2004 Combinitorial resist processing studies

Carl E. Larson, Gregory M. Wallraff

Proceedings Volume 5376, Advances in Resist Technology and Processing XXI; (2004) https://doi.org/10.1117/12.538684
Event: Microlithography 2004, 2004, Santa Clara, California, United States

Abstract

A new processing tool, the Thermal Gradient Plate (TGP) is described. The TGP allows for a range of temperatures to be expressed on a wafer or other substrate in a controlled and reproducible manner. Materials coated on a substrate can be baked across a range of temperatures, allowing multiple experiments to be run in parallel. Combining orthogonal TGP bakes creates a matrix of temperature pairs on a single wafer, allowing two bake step processes to be studied in a single experimental run. Experimental results demonstrating a variety of resist studies are described, including resist CD temperature dependence, underlayer cure temperature determination, and two bake step interactions.

Citation Download Citation

Carl E. Larson and Gregory M. Wallraff "Combinitorial resist processing studies", Proc. SPIE 5376, Advances in Resist Technology and Processing XXI, (14 May 2004); https://doi.org/10.1117/12.538684

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