14 May 2004 Combinitorial resist processing studies
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A new processing tool, the Thermal Gradient Plate (TGP) is described. The TGP allows for a range of temperatures to be expressed on a wafer or other substrate in a controlled and reproducible manner. Materials coated on a substrate can be baked across a range of temperatures, allowing multiple experiments to be run in parallel. Combining orthogonal TGP bakes creates a matrix of temperature pairs on a single wafer, allowing two bake step processes to be studied in a single experimental run. Experimental results demonstrating a variety of resist studies are described, including resist CD temperature dependence, underlayer cure temperature determination, and two bake step interactions.
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Carl E. Larson, Carl E. Larson, Gregory M. Wallraff, Gregory M. Wallraff, } "Combinitorial resist processing studies", Proc. SPIE 5376, Advances in Resist Technology and Processing XXI, (14 May 2004); doi: 10.1117/12.538684; https://doi.org/10.1117/12.538684

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